![]() Able to spread and wet using straight ramp or soak reflow profiles in air.Excellent print volume and print volume repeatability down to 12 mil (0.3mm) features.Standard Type 3 solder paste contains 25-45 micron size.This product contains 96.5% Tin /3.0% Silver /0.5% Copper.WS-820 has excellent fine feature printing and an 8 hour stencil life.Yields class-leading wetting performance in ovens with ambient air.WS-820 was adapted from WS-819 to increase the reflow profile window.If you are looking for a solder paste with these specifications (96.5% Tin 3.0% Silver, and 0.5% Copper), this paste is one of the best! It is packed in a 500 gram jar and produces superior solder spread and shiny joints. In fact, it is one of the best solder pastes for electronics and gives you more bang for your buck! This high-quality solder paste is designed to meet the demands of electronics manufacturing as it provides exceptional performance and reliability. Elevate your soldering experience with WS-820! It is comprised of 96.5% Tin, 3.0% Silver, and 0.5% Copper Type 3 Powder, it's also halide-free. Enjoy outstanding fine feature printing and an impressive 8-hour stencil life. This Type 3 solder paste sets a new standard by minimizing solder voiding on BGA assemblies compared to other water-soluble options reflowed in air. Derived from the acclaimed WS-819, WS-820 extends the reflow profile window for even greater flexibility. Introducing Alpha Metals' SAC305 WS-820, a cutting-edge water-soluble lead-free solder paste engineered for exceptional wetting performance in ovens with ambient air. Introducing the Alpha Water-Soluble Solder Paste which is available in a convenient 500g jar! Lead-Free Wire Solder for Industrial Soldering Lead-Free Wire Solder for Electronic Assembly ![]() Lead-Free Solder Bar for Soldering & Tinning Electronics Lead-Free Solder Bar for Industrial Soldering & Tinning Solder Bar & Solder Wire - Leaded & Lead-Free
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